Pack Expo show floor

Get Smarter About Automated Packaging at Pack Expo

Sept. 12, 2019
PMMI, The Association for Packaging and Processing Technologies, is bringing PACK EXPO to the Las Vegas Convention Center this Sept. 23 to 25.

Co-located with Healthcare Packaging Expo 2019, Pack Expo’s 2,000 exhibitors will host an expected 30,000 attendees across the 900,000 ft2 exhibit floor. Of special interest to H&P’s specialized audience will be the Roboics Zone, set up in the North Hall to showcase some of the latest robotics technologies.

Packaging systems and their enabling technologies will also be discussed in detail via forum sessions held in the Central Hall. These free, 45-min. learning sessions will cover the latest industry trends via hands-on activities, small group discussions and Q&A periods. Here are a few examples that may interest you:

Faster, Smaller, Smarter: Drive Technology Advances Power Next-Gen Packaging

Jeff Johnson, mechatronics product manager at Beckhoff Automation, will demonstrate how controls engineers and plant managers can use new mechatronic motor and drive technologies to reduce maintenance and increase efficiency in motion control and mechanical engineering.

How an IIoT-Enabled Pneumatic System Improved OEE in an Agricultural Packaging Application

Dana Greenly, director of business development, Food & Beverage Americas at Emerson, will show how an Industrial Internet of Things (IIoT) enabled pneumatic system improved the performance of agricultural end-of-line bagging operations.  The focus will be on monitoring real-time machine and component performance, using built-in diagnostic analytics, and setting predictive maintenance alerts.

How IO-Link is Revolutionizing OEE, Change-Over, and Predictive Maintenance

Greg Molinaro, packaging, food & beverage industry manager Americas at Balluff, will show how machine builders are enabling intelligent devices to assist with change-over and predictive maintenance to improve overall equipment efficiency and to provide flexible smart machines in an IIoT environment.

The following organizations will also hold interactive sessions at The Forum:

  • OpX Leadership Network
  • Contract Packagers Assn.
  • Institute of Packaging Professionals
  • The Organization for Automation and Control
  • Robotic Industries Assn.
  • World Packaging Organization
  • PMMI University
  • PMMI Business Intelligence

For more information and to register online, visit packexpolasvegas.com and hcpelasvegas.com.

About the Author

Tom Andel

Tom Andel is an award-winning editorial content creator and manager with more than 35 years of industry experience. His writing spans several industrial disciplines, including power transmission, industrial controls, material handling & logistics, and supply chain management. 

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